EXPLACE

קול קורא

DevelopEX2017 - קול קורא

 

מאחר ומדובר בכנס בינלאומי המסמך נכתב בשפה האנגלית. בשפה זו יש גם להגיש את טפסי הבקשה להרצאה

 

DevelopEX2017  is the major annual event dedicated to developers of embedded and electronic systems. DevelopEX2017 main goal is to stimulate Israeli engineers in various technological applications and present the latest developments in electronic design technologies.

DevelopEX2017  invites any person or company involved with the development and/or implementation of outstanding/innovative technologies or services related to electronic systems, to submit a paper addressing the advantages and/or unique capabilities developed in his company and/or products.


Submissions must be made with the attached DevelopEX2017 – Call for Paper

Topics of Interest

DevelopEX2017 seeks papers addressing one of the following topics:

  • Automotive Technologies
  • Smart Systems & IOT
  • Storage, Big Data & Cloud
  • Machine Learning & Robotics
  • Machine Vision, Electro-optics and Imaging Technologies  
  • High Efficiency & Low Power Design
  • PCB Materials, Design tools and Processing  
  • Security & Testing  
  • Embedded Software and OS
  • Packaging, Cables and Harness Characteristics  
  • High Speed Computing and Design Technologies  

The main topic of DevelopEX2017 is "The impact of cognitive computing (including AI, VR, Machine Learning & Machine Vision) on the digital era". Papers that specifically refer to this topic will be treated with higher priority.

The following is the process for any paper submission.

  1. The paper should only address one of the selected topics (see below a detailed list of interesting topics).
  2. The author must be ready to present the topic at DevelopEX2017 . The author or his/her representative will have 20 minutes to present the paper.  
  3. Presentations should not be marketing oriented and not biased towards the author's company or business interests.
  4. Papers which were previously published or simultaneously under review by another conference will be rejected, unless received special authorization by the organizers of DevelopEX2017 . Please inform the TPC about the fact that your paper was previously published or simultaneously under review by another conference when you submit your paper.  
  5. Authors of submitted papers agree to release the organizers of DevelopEX2017 from any IP rights, copyright terms or responsibility for exposing the content of their documents to the conference audience or for publishing it in their web site.


Submissions not complying with these terms will be rejected.

List of interesting topics


Papers should be submitted only in one of the following categories:

Automotive Technologies

  • Electronic Systems for car safety  
  • The latest in connected car  
  • Smart sensors for car security  
  • Creative technologies for passengers' monitoring systems  
  • Embedded technologies for electric motors  
  • Accident warning systems  
  • New technologies for Automated mobility  
  • Innovative solutions for unmanned transportation  
  • Improved interfaces for the automotive industry  
  • Better systems for traffic control and navigation


Smart Systems & IOT

  • Smart sensing for industrial applications (incd. Industry 4.0)  
  • Smart cities applications  
  • The Internet of everything - how people, process, data, and things are brought together by connections to the Internet  
  • New implementations of IOT (Internet of Things) applications
  • Smart home, Smart car, Smart city, Smart health/medical applications  
  • Short distance communication (incld. Bluetooth , Wifi & Zigbee) for IOT applications  
  • M2M – components, modules and systems  
  • Wireless Sensor Networks  
  • UWB – Broadband data transmission  
  • 4G / UMTS / WiMAX /LTE – high speed data for mobile telephony a long distance usage  
  • Methods for efficient wired communication  
  • Interoperability and Coexistence of wireless sensor networks and systems  
  • RFID & NFC– new developments and applications  
  • New WLAN technologies, standards and applications  
  • EMC and interoperability problems  
  • Faster I/Os and waveforms, as well as RF, MEMS, and sensor components  
  • Design challenges for wearable electronics  
  • RF/microwave techniques for digital interconnects (e.g. de-embedding, equalization, filtration)  
  • Techniques for interconnects and passive components of digital and RF/microwave systems  
  • S-parameters in analysis of broadband interconnect systems  
  • Analysis validation for RF technologies  
  • Embedded passive components (e.g., capacitors, inductors, delay lines)  
  • Analysis of losses, dispersion, coupling and mode conversion in interconnects  
  • Effects of discontinuities in interconnects (e.g., vias, connectors, launches, transitions, serpentines)  
  • Broadband dielectric and conductor characterization (e.g., loss and dispersion, roughness, anisotropy, fiber weave effect)


Storage, Big Data & Cloud

  • Distributing processing power between local devices and remote (cloud) processing
  • The latest design techniques for storage systems
  • How to design memory and parallel interface to meet system performance requirements
  • Processing accelerators
  • Designing for the big data processing requirements
  • Memory interface and 3D integration
  • Mobile memory designs (LPDDR, DDR-NAND, UFS)
  • Mainstream memory designs (DDR, GDDR, RLDRAM)
  • WideIO, HBM, and HMC memory interfaces
  • Proprietary or emerging 2.5D and 3D I/O interfaces
  • High-speed parallel interface design
  • Standards-based storage design
  • Building the proper storage architecture
  • Parallel interconnect signal conditioning techniques
  • Designing the proper memory control architecture
  • Crosstalk and simultaneous switching noise impacts
  • Power, thermal cost versus performance analysis

Machine Learning & Robotics

  • Machines learning for the automotive industry  
  • The Disruptive Power of (AI) Artificial Intelligence  
  • Possible implementations for Intelligent machines  
  • Using computer-on-module devices for Virtual reality applications  
  • Robotic handling operations  
  • Mesh Apps and intelligent architecture  
  • Digital technology platforms  
  • Robotic Welding  
  • Robotic Assembly  
  • Robotic Dispensing  
  • Robotic Processing
  • Single board computers for Robotics applications

Machine Vision, Electro-optics and Imaging Technologies

  • Machines vision for printed circuit board (PCB), wafer dicing, wafer probing, frame inspection, and die bonding  
  • Machine vision for pharmaceuticals & healthcare applications
  • Intelligent transportation system  
  • Quality assurance & inspection in the manufacturing industry. [e.g. bar code identification, number plate recognition, etc.]  
  • Techniques to bring together high-speed electrical and high-speed optical circuits  
  • The latest in lasers & photonics technologies  
  • What can you do with radiometry
  • Emerging opportunities for image sensors  
  • Measurement and testing of optical/electrical ICs  
  • Dealing with coexistence issues when integrating optical and/or wireless transmission, e.g. EMI, integration  
  • Microwave photonics  
  • Photonic interconnects  
  • Photonic integration and packaging design  
  • Link design & impairments  
  • Optical signal processing  
  • Passive components for 100 Gbps/400 Gbps optical communications  
  • Wireless and optical network convergence  
  • Layout considerations for photonic circuits  
  • High-speed Electro-optics communication  
  • Making wireless technology work with digital systems in terms of signal integrity  
  • Antenna design and placement  
  • FCC qualification; interference mitigation Integrated optical links, optical interconnects  
  • Utilizing the latest imaging technologies

 

High Efficiency & Low Power Design

  • Innovative methods for low power design & utilizations  
  • Power management for best system functionality and performance  
  • Designing ultra-low power circuits for wearable,drones ,mobile and IOT devices  
  • Multi-voltage design  
  • PDN performance versus cost, size, yield, reliability, etc.  
  • Power distribution and regulation  
  • Dynamic and static voltage variations  
  • Charge delivery analysis  
  • Power supply design  
  • DC/DC converter and VRM design  
  • Power supply design, dynamic response  
  • Power efficiency management strategies  
  • Power-aware architecture  
  • Power modes management  
  • Wireless power charging  
  • Low-power designs

PCB Materials, Design Tools and Processing

  • The latest in PC boards technologies  
  • The importance of quality package in electronics systems  
  • New PCB materials
  • Design tools for PCB  
  • How (PCB) materials can affect the electrical properties
  • The impact of fabrication processes on circuit performance  
  • Advanced conductive and dielectric materials  
  • Manufacturing impact on electrical properties  
  • The impact of copper on characterization and design  
  • Microvias, High aspect-ratio vias, RF vias and thermal vias  
  • Materials consideration for PCB implementations
  • Advanced laminate and PCB processing  
  • Interlayer connectivity alternatives  
  • Backdrilling methods and effects  
  • Passive and active devices  
  • Embedded optical channels  
  • Rigid-flex and multilayer flex circuit design and manufacturing  
  • Lead-free materials (RoHS)  
  • The Fabrication trade-offs: cost ,performance and reliability
  • Materials characterization and modeling  
  • PCB and packaging considerations  
  • Sockets and connectors  
  • Thermal characterization  
  • Electrical, mechanical and optical co-design: choices and trade offs  
  • EM modeling of PCB traces and vias  
  • PCB design challenges, tools, and techniques  
  • PCB test and measurement  
  • Thermal and noise interaction between digital interfaces and subsystems  
  • Sockets and connectors  
  • Via pin-field design  
  • Material/dielectric modeling and characterization  
  • Advances in high-speed conductive surface modeling

Security & Testing

  • Secure elements & solutions  
  • How to ensure the security of your electronics design
  • Hardware based security technologies  
  • Cyber protection solutions for maximum system security  
  • Measurement challenges and solutions  
  • Accuracies and quality issues involved when trying to match simulations with measurements  
  • Instrumentation performance and measurement errors  
  • Standards-based measurement methods  
  • Analog, mixed-signal and RF testing  
  • On-die test instrumentation  
  • Package, connector, board testing  
  • Fixture de-embedding methodologies  
  • Fault monitoring and failure analysis  
  • Resolution and sensitivity of measurement tools  
  • Active/passive device-measurement methods  
  • Package, board and system measurement methods  
  • Testing of 3D design methods  
  • Yield analysis and yield enhancement  
  • Pre-qualification testing for immunity (radiated, ESD, etc.) and emissions.

Embedded Software and OS

  • How to accelerate design cycle with System modules
  • The latest in Open Source software & OS
  • Operating systems characteristics
  • Performance trade-offs: electrical, mechanical, thermal
  • Analog and Mixed-Signal Modeling and Simulation Challenges
  • System Co-Design: Modeling and Simulation
  • Embedded software and Interfaces
  • Optimize High-Speed Serial Design
  • How smart is your OS - new & advanced operating systems
  • Detect and Mitigate Jitter, Crosstalk, and Noise
  • High-Speed Signal Processing for Equalization & Coding
  • Electromagnetic Compatibility/Mitigating Interference
  • Signal Integrity with RF/Microwave/EM Analysis Techniques
  • The new generation of Firmware systems


Packaging, Cables and Harness Characteristics

  • BGA packaging
  • Assembly parts and processes
  • Embedded passive and active devices
  • Best methods to design your packaging
  • Wire and cable harness technologies
  • The challenges in packaging
  • How to address mil spec packaging specifications
  • The importance of efficient packaging
  • Backplane and cable interconnect
  • Backplane and cable signal conditioning


High Speed Computing and Design Technologies

  • Tips for better/faster design
  • High Speed computing
  • High-speed signaling
  • PCB materials for high-speed power integrity
  • Design consideration for High-speed data transfer and communications (board level)
  • Effective high-speed design solutions
  • Peripherals design challenges (MIPI, USB)
  • Copper vs. fiber trade-offs
  • Design verification and validation
  • Ethernet architectures
  • Loss and timing budgets for electrical or optical links
  • Physical modeling and simulation
  • Signal integrity for backplanes and cables
  • System interconnect architecture
  • Switch-fabric architectures
  • Analysis of signals on interconnects with high data rates
Submission Form via e-mail to info@developex.co.il  by September 12, 2017 no later than 7:00pm Israel time . All submitted papers will be reviewed and selected by DevelopEX2017 TPC (Technical Program Committee) headed by Professor Tsahi Birk, head of the parallel systems lab, Technion.

Authors of accepted papers will be invited to present their topic at DevelopEX2017 , scheduled for October 31, 2017 in Tel Aviv, Israel.

 

Call for paper submission form

עבור לתוכן העמוד